Columbia Researchers Develop New Method to Isolate Atomic Sheets and Create New Materials

February 20, 2020
atomically thin semiconductor wafers (MoS2 monolayers, lateral dimension of each panel ~ 1cm, wafer thickness of only ~0.7 nm)

New exfoliation method makes large-area atomically thin layers that can be stacked in any desired order and orientation to generate a whole new class of artificial materials; opens the door to new research and commercialization.

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